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Possible AMD RDNA 5 GPU IP Ships Inside a Samsung SoC on 2 nm Node

TechPowerUp·2026/9/2 16:01:21🔗 原文

📌 概要

SemiAnalysis对三星Exynos 2700 SoC的裸片标注显示,AMD最新RDNA 5 GPU IP以Xclipse 970的形式出现在该移动芯片中,这将是首款出货的RDNA 5芯片。该SoC采用三星SF2 2nm工艺,配备独特的10核CPU配置,旨在对抗高通骁龙旗舰SoC。

⚡ 关键要点

  • Exynos 2700集成基于RDNA 5的Xclipse 970 GPU,为首款出货的RDNA 5芯片
  • SoC采用三星SF2 2nm工艺制造
  • 采用独特10核CPU配置,对标高通骁龙Elite系列
Today marks the day we see AMD's next-generation RDNA 5 GPU IP inside working silicon, but not in the form you might expect. Thanks to SemiAnalysis's die annotation of the Exynos 2700 SoC from Samsung, we see AMD's new GPU IP shine in a mobile form with the Xclipse 970 GPU. As earlier leaks reported, AMD and Samsung co-developed the Xclipse 970 GPU using AMD RDNA technology and adapted it for mobile. However, the GPU IP has now been upgraded to the latest RDNA 5, making this SoC technically the first RDNA 5-equipped chip that will be shipping. Built on Samsung Foundry's SF2 node, Samsung has designed this SoC with a unique 10-CPU core configuration and a strong GPU to compete with Qualcomm Snapdragon Elite SoCs.

On the CPU front, Samsung uses Arm's off-the-shelf CPU core IP, which includes C2-Ultra and C2-Pro. This setup features a single C2-Ultra big core running at 4.24 GHz, one C2-Ultra running at 3.36 GHz, four C2-Pro cores running at 3.74 GHz, and four C2-Pro cores running at 2.88 GHz, making a total of 10 CPU cores. On the GPU side, the Xclipse 970 packs eight GPU WGPs, each containing two Compute Units. This results in 16 CUs on the GPU front if everything remains the same with RDNA 5 and no changes to the WGP/CU ratio have been made by AMD since the last-generation RDNA 4. Read full story