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Multi-Die Design for Automotive Applications
📌 概要
多芯片（Multi-Die）设计正成为汽车应用如ADAS高级驾驶辅助和IVI车载信息娱乐系统中不可或缺的技术，以满足汽车行业对高可靠性与功能安全的严苛要求，推动先进封装在车载芯片中的普及。
⚡ 关键要点
- ▸多芯片设计日益成为汽车应用的关键技术
- ▸主要服务于ADAS与IVI等车载场景
- ▸核心驱动因素是可靠性、安全性及性能需求
Multi-die design is becoming indispensable for automotive applications, such as ADAS and IVI, addressing demands for reliability and safety.
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