资讯🔥7.0
GlobalFoundries and RAAAM Memory Technologies Announce Joint Development
📋总体概括
GlobalFoundries与RAAAM Memory Technologies宣布联合开发，目标为FDX平台提供最密集的标准CMOS片上存储方案。FDX平台广泛用于先进AI芯片，该方案相比商用SRAM可实现40%面积缩减和最高60%的功耗降低，有望提升AI芯片的集成度与能效。
⚡关键信息
- ▸GlobalFoundries与RAAAM宣布联合开发片上存储技术
- ▸目标是为FDX平台提供最密集的标准CMOS存储方案
- ▸相比商用SRAM面积缩减40%、功耗最高降低60%
🔥犀利点评
AI芯片吃存储，SRAM替身生意越大越香，关键看量产落地。
Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAM.
The post GlobalFoundries and RAAAM Memory Technologies Announce Joint Development appeared first on Semiconductor Digest.